PCBONLINE
PCBONLINE is an EMS PCB supplier for medical, automotive, industrial, etc. Visit us at pcbonline.com.
12/03/2026
๐๐ก๐ฒ ๐๐๐ก๐๐ฌ๐ข๐ฏ๐ ๐๐ข๐ฌ๐ฉ๐๐ง๐ฌ๐ข๐ง๐ ๐ข๐ฌ ๐ญ๐ก๐ "๐๐ข๐ฅ๐๐ง๐ญ ๐๐ฎ๐๐ซ๐๐ข๐๐ง" ๐จ๐ ๐๐๐ญ๐ญ๐๐ซ๐ฒ ๐๐๐๐๐ญ๐ฒ ๐ก๏ธ๐
In the world of Cell Contact Systems (CCS), precision welding and robust busbars get all the glory. But there is a critical process happening behind the scenes that determines whether a battery pack lasts 5 months or 5 years: Adhesive Dispensing.
At ๐๐๐๐๐๐๐๐๐, we treat dispensing as a core safety pillar.
How Dispensing Protects Your Battery Pack:
๐ ๐๐จ๐ง๐ง๐๐๐ญ๐จ๐ซ ๐๐๐ข๐ง๐๐จ๐ซ๐๐๐ฆ๐๐ง๐ญ: Prevents pin damage from vehicle vibrations.
๐ ๐๐๐ & ๐
๐๐๐ ๐๐ซ๐จ๐ญ๐๐๐ญ๐ข๐จ๐ง: Seals sensors against moisture and electrolyte vapors.
๐ ๐๐๐ฅ๐ ๐๐จ๐ข๐ง๐ญ ๐๐ง๐ฌ๐ฎ๐ฅ๐๐ญ๐ข๐จ๐ง: Prevents oxidation of nickel/copper solder joints.
The PCBONLINE Advantage:
We specialize in turnkey CCS for ๐๐ง๐๐ซ๐ ๐ฒ ๐๐ญ๐จ๐ซ๐๐ ๐ (๐๐๐), ๐-๐ฆ๐จ๐ญ๐จ๐ซ๐๐ฒ๐๐ฅ๐๐ฌ, and ๐๐จ๐ฐ-๐ฌ๐ฉ๐๐๐ ๐๐๐ฌ (Golf carts, Yachts). We control the entire chainโfrom FPC fabrication to laser weldingโallowing us to offer a 5-๐ฒ๐๐๐ซ ๐ช๐ฎ๐๐ฅ๐ข๐ญ๐ฒ ๐ ๐ฎ๐๐ซ๐๐ง๐ญ๐๐.
๐ Check the first comment for our full technical blog on CCS Dispensing!
19/09/2025
The key to solder paste stencil design is designing the stencil apertures properly. Our engineering team has rich experience in solder paste stencil design. We don't just copy pad shapes but also adjust aperture designs to prevent solder defects and form long-term solder joints.
Here are some proven stencil design techniques used at :
Fine-pitch ICs and QFPs โ To prevent stress concentration, we design the two ends of the aperture with rounded corners.
BGAs and ultra-small passives (0402, 0201) โ Square-shaped apertures are used for consistent solder ball formation.
QFN ground pads โ When applying a cross-shaped ("+") aperture, we ensure at least 0.5 mm clearance from the PCB pad edge to avoid solder beads and guarantee effective grounding.
USB, Mini USB, and CF/SD connectors โ For connector grounding apertures, we extend the length in a 1:1.2 ratio to increase solder volume. To reduce stress and prevent solder beads, we use an inward concave opening method.
General ball-grid aperture rule โ The aperture width must allow at least four solder balls to pass through freely, ensuring reliable reflow results.
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Ansheng Road, No. 4 Building Shajing, Baoan District
Shenzhen
518100