3D InCites

Have you listened to the latest podcast episode?

Tune in to hear about the highlights of breakthrough technologies at this year’s ECTC.

Glass core substrates emerged as the star technology of the conference, with standing-room-only sessions demonstrating the industry’s intense interest in this promising material platform. Co-packaged optics also generated similar enthusiasm.

Monita Pau, Charles Lee, Mark Ge**er, Tim Olson, Scott Sikorski, Roland Rettenmeier, Simon McElrea, Henan Zhang, and Evelyn provide further insight into these technologies.

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This past Friday .mcnichol learned about next-generation bonding technologies at the Arizona chapter event. Hosted by at its Tempe facility, here’s the latest on bonding solutions for scaled devices. 

* Hybrid bonding is still expected to scale, and it’s already a widely preferred interconnect method
* Lower maintenance laser sources can offer a solution for removing inorganic materials on ultra-thin wafers 
* Innovation still needs to happen on the material side to scale transistors, but the semiconductor industry is making progress 
* Sub-micron wafer-to-wafer hybrid bonding has been demonstrated, and it’s expected to go into production soon 

Interested in learning more about EVG’s hybrid bonding capabilities? Check out the EVG website. https://www.evgroup.com/

The microelectronics industry thrives on constant innovation, particularly in advanced packaging technologies that enable tomorrow’s high-performance systems. In this special episode, we spotlight the winners of the 3D InCites Awards, recognizing excellence in heterogeneous integration, 3D-HI, and chiplet technologies.