Golden Altos
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Serving the semiconductor, military and aerospace industries since 1984.
05/25/2026
Memorial Day reminds us to honor those who made the ultimate sacrifice for our freedoms.
Their dedication and courage inspire generations.
At Golden Altos, we pause to reflect and give thanks for their service.
Join us in honoring their legacy and sharing gratitude this Memorial Day.
What does a destructive bond pull test actually tell you about bond integrity?
More than wire strength. It reveals how a bond truly behaves under stress and how it fails at its weakest point.
A destructive bond pull test applies a controlled, increasing force to a wire bond until it breaks. The value is not just in the force at failure, but in what the failure mode says about the process.
Performed per MIL-STD-883 Method 2011, this test helps characterize:
✅ Actual mechanical integrity of the wire bond
✅ Failure mode behavior (heel break, wire break, bond lift, etc.)
✅ Process stability across the assembly flow
As a U.S.-based OSAT focused on high-reliability assembly and test, destructive testing is essential to validate process integrity before devices enter mission-critical environments.
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44061 Old Warm Springs Boulevard
Fremont, CA
94538
Opening Hours
| Monday | 8am - 5pm |
| Tuesday | 8am - 5pm |
| Wednesday | 8am - 5pm |
| Thursday | 8am - 5pm |
| Friday | 8am - 5pm |
