Gel-Pak

Visit us at MD&M West from February 7-9 in Anaheim, CA.💡Whether you’re a large Fortune 500 company or a small startup manufacturer, we’ve got solutions for your devices, including biocompatible elastomer-coated boxes, slides, trays and films as well as custom extrusion and coating of PDMS, TPU and other specialty films. Visit us at booth #2566 to learn more!

The 2023 IPC APEX EXPO is just around the corner! If you’d like to speak with us during the show, reach out to Jennifer Nunes at [email protected]. We’d love to talk about how we can work with you to develop custom and innovative solutions for device handling and transport.

The global semiconductor industry has a complex supply chain process that requires IP, equipment, packaging, and other components, oftentimes sourced from multiple regions for a single resulting product. Semiconductor Engineering recently looked at the challenges. Click here to learn more:

Strengthening The Global Semi Supply Chain Robust partnerships and multi-party innovation will be essential to manage complexity and cost.

Could extend Moore’s law? EE Times recently published an insightful article on the advantages of chiplets to improve yield on each wafer and reduce production costs, and we’re exploring opportunities to support this emerging market. Read the article: a.

Moving from SoCs to Chiplets could help extend Moore’s Law - EE Times As Moore’s Law is again reaching its limits, several technologies, specifically Chiplets, could be the key to extending it for many more years. Moore’s

Be sure to visit us at IMAPS International from October 3-6 in Boston! We will be onsite in booth 209 and hosting two poster sessions. CTO Raj Varma will discuss how our micro-textured film supports universal handling of 3D devices, while BAE Systems’ Craig Blanchette will showcase our collaborative LCS2 Lid/Clip System that prevents thin semiconductor die from migrating during shipping and handling. www.gelpak.com/lcs2 and https://www.gelpak.com/texturized-film-device-carrier-products/