On-site Computer Support & Services

Chip on Wafers on Substrate

TSMC is facing a surge in AI chip orders using its advanced packaging technology, such as CoWoS, but competitors such as Intel are benefiting as the Taiwanese semiconductor powerhouse is unable to keep up with demand.

The is releasing this FLASH to highlight the tactics, techniques, and procedures (TTPs) and indicators of compromise (IOCs) associated with the cyber criminal group TeamPCP. TeamPCP actors have conducted large-scale software supply chain compromises by targeting widely used developers and security tools, gaining access to victim environments and extracting sensitive data, including but not limited to cloud access tokens, SSH keys, and Kubernetes secrets. The FBI encourages organizations to contact the FBI if they have been compromised, and to implement the actions in the Recommendations section to reduce the likelihood and impact of compromise by TeamPCP actors.

Learn More Here:https://www.ic3.gov/CSA/2026/260702.pdf