PCB Power USA

CAF (Conductive Anodic Filament) is one of the most overlooked causes of long-term PCB failure.

It doesn’t appear as a visible defect and it rarely starts at fabrication.

In most cases, it begins with layout decisions such as conductor spacing, inner-layer pad handling, and via alignment.

This post highlights a few key design practices engineers should watch for.

Read the full blog to understand CAF risks and prevention strategies in detail:

https://www.pcbpower.us/blog/caf-in-multilayer-pcb

The best PCB builds start with the BOM in hand, not at the last minute.

Planning early gives you visibility, control, and confidence:
✔ Spot long-lead items before they stall production
✔ Lock in alternate suppliers to avoid surprises
✔ Align footprints, MSL, and stack-ups across teams
✔ Proactive DFM + BOM checks reduce rework

Whether Turnkey, Combo, or Consigned, early planning keeps your workflow smooth.

Read the full blog: [https://www.pcbpower.us/blog/design-stage-sourcing-with-early-bom-planning]