SAM Sputter Targets

Did you know the memory chips (DRAM & Flash) in your phone and computer are built on two completely different kinds of "micro-skyscrapers"? One requires drilling incredibly deep "wells," the other involves stacking incredibly tall "floors."

This poses a massive challenge for a key chip-making step: thin-film coating. Our new article explains, in accessible terms, how engineers use a core material—the "sputtering target"—to perfectly coat these "deep wells" and "tall towers" with their necessary metallic layers.

Curious about the micro-manufacturing magic that holds up our digital world?

🔗 Read the article: https://www.sputtertargets.net/blog/target-strategy-for-dram-3d-nand-from-capacitor-electrodes-to-step-coverage.html

PVD Targets for DRAM & 3D NAND Manufacturing This article dissects the critical PVD target strategies for both technologies: the pursuit of seamless, high-aspect-ratio fill for DRAM capacitors, and the battle for conformal step coverage in 3D NAND's towering staircases.