Dynatex International

The DXB 880 wafer bonder adds automated process control to the DXB series' list of benefits.

The user is able to program each process step with extreme precision, ensuring a repeatable and consistent process. Active cooling and dual chamber operation ensure speed and accuracy.

Introducing Dynatex International's new GSX Scribe and Break!

The GSX is the latest in Dynatex International's line of advanced wafer dicing equipment. Available as a Scribe and Break or Break Only system, the GSX is built upon existing GST systems and introduces many features previously exclusive to our DTX series.

Learn more at:
http://www.dynatex.com/gsx-refurbished-gst_8_108_26191.html

Dynatex International is excited to announce the launch of our new company website! Created with our customers in mind, our new website features easier navigation, in-depth product information, and a range of downloads and technical data for all of our product lines. Visit our new website at: www.dynatex.com